Pdf — Ipc-7352

Includes generic guidelines for both through-hole and surface mount land patterns to ensure sufficient area for solder fillets.

series. This updated document provides the foundational principles for creating both surface mount (SMT) and through-hole (THT) land patterns to ensure high-quality solder joints and manufacturability. Core Purpose and Scope Design Standardization Ipc-7352 Pdf

: The primary source for the latest version. Core Purpose and Scope Design Standardization : The

While IPC-7351B was the industry staple for years, IPC-7352 was developed to better reflect modern manufacturing capabilities. It incorporates: : Expanded conventions to include thermal pad details

IPC-7352 is the official industry standard titled Published by the Association Connecting Electronics Industries (IPC), this document provides the requirements for creating land patterns (also known as footprints or pads) for surface mount components.

: Expanded conventions to include thermal pad details and hidden pins.

: Footprint naming convention now includes specific component tolerances and thermal pad sizes. Producibility and Density Levels